3-D Monitoring of plasma etch endpoint using laser hologram
- 總結
- This sensor system is composed simply of a laser, charge couplded device, and a beam expander. Laser holograms store all the interactions between plamsa and laser particles. The system is based on new concepts of light. The energy distributions extracted from laser holograms at multiple wafer places are traced to detect etch endpoints. No existing sensors can do this.
- 技術優勢
- This sensor can be used for real-time monitoring of etch endpoints during the etching of thin films at multiple positions across the wafer. Major users of this system are the makers of chips or display.
- 申請號碼
- WO2014038827
- 覆蓋範圍
- USA
- 商品和服務
- Sale, License agreement
- 專利信息
- Issued patent
- 國家/地區
- 南韓
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